Skip to main content
About
About Iieta
Policies
Services
Subscription
Fast Track
Language Support
Conference Services
Publication Services
Journals
CONFERENCES
Books
Submission
Search form
Search IIETA Content
-Any-
Article
Basic page
Blog entry
Journal
Event
Feature
Home
Thermal Stability Prediction and Structural Optimization of Intelligent Packaging for Light Industry Based on Thermal Network Modeling and Electronic Cooling Simulation
https://www.iieta.org/sites/default/files/pdf/2026-01/ijht_43.06_06.pdf